Copper |
| Copper Process-Cupsal Z |
| APPLICATIONS: |
A sodium
cyanide based solution recommended where simplicity and economy are important. Slow speed
solution suitable for manual plant and general-purpose light copper plating. The desposit
is dull. |
| OPERATING
CONDITIONS: |
50 to 130 g/l,
50 to 55C, 0.5 to 1.0 A/dm2 |
| High Efficiency Copper Process-Cupsal
CX |
| APPLICATIONS: |
A potassium
cyanide based solution which produces a fine grained deposit. A high speed solution with
excellent throwing power. Suitable for thick copper deposits and as an undercoat for
bright nickel on steel and zinc based dicastings. Rack or barrel use. |
| OPERATING
CONDITIONS: |
160 to 210
g/l, 55 to 65C, 2 to 4 A/dm2 with periodic reverse current. pH 11.5 to 12.5. |
| High Efficiency Bright Copper-Cupsal
CB |
| APPLICATIONS: |
A potassium
cyanide based solution which produces bright deposit. A high speed solution with excellent
throwing power. Fully bright deposit ideal for use on zinc based diecastings. |
| OPERATING
CONDITIONS: |
150to 200 g/l,
50 to 55.C, 2 to 4 A/dm2, pH 11.5 to 12.5 |
| Acid Copper-Cupsal AD |
| APPLICATIONS: |
A fully bright
acid copper with extremely high leveling power suitable for decorative use and
electroforming. For plating steel, since alloys and plastic components. |
| OPERATING
CONDITIONS: |
Cupsal AD Base
Salt - 200 g/l, + H2So4 + Brightener Cupasl ADA - 10m/l, 18 to 30C, 2 to 7.5 A/dm |
| Rochelle Copper-Cupsal RH |
| APPLICATIONS: |
A mildly
alkaline, low cyanide based cooper plating process, designed for zinc based alloy
diecastings. |
| OPERATING
CONDITIONS: |
125 5o 200 g/l,
50 to 60.C, 1 to 5 A/dm2. |
